ABOUT THE TEAM
OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.
ROLE OVERVIEW
We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions.
The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical and thermal performance, and system scalability for advanced heterogeneous integration platforms.
IN THIS ROLE YOU WILL
- Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.
- Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.
- Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.
- Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.
- Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.
YOU MIGHT THRIVE IN THIS ROLE IF YOU HAVE
- Enjoy solving extremely challenging thermal, mechanical and electrical challenges for some of the most advanced AI/HPC packaging technology.
- Are motivated by pushing the limits of heterogeneous integration, high-power delivery, advanced cooling, and large-scale packaging architectures.
- Like developing new modeling methodologies and engineering solutions rather than relying only on conventional industry approaches.
- Want to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design.
- Enjoy learning broadly across semiconductor technologies, including chip architecture, power delivery, package integration, materials, cooling, and system-level interactions.
- Strong experience in thermal and mechanical modeling for advanced packaging systems.
- Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
- Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches.
- Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent.
- Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions.
PREFERRED QUALIFICATIONS
- Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications.
- Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- MS or PhD in Mechanical Engineering,