Manufacturing Engineer, AI Satellites (Starmind)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

MANUFACTURING ENGINEER, AI SATELLITES (STARMIND)  

SpaceX is leveraging its experience deploying and operating the world’s largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. Realizing this vision demands highly reliable, high-performance electrical compute hardware, solar power systems, thermal radiators, and more. These systems must operate in the extreme environment of space while delivering the connectivity, control, power distribution, and processing needed for orbital AI inference.  

The Starmind team designs, builds, and operates the orbital compute fabric of the future. We develop nearly every key piece of technology in house – from the satellites’ flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers. As a Manufacturing Engineer on the Starmind team, you’ll have ownership over the entire manufacturing line for the hardware that enables advanced on-orbit AI processing and data center workloads. Your work spans the assembly, integration, and testing of industry-leading compute electronics, memory, and networking in order to achieve required domain sizes and processing workloads.  

RESPONSIBILITIES  

• Own the development and optimization of high-rate manufacturing for satellite    

• Own the full lifecycle of equipment specification, validation, and process development— including device modeling, characterization of performance metrics, and materials failure analysis.   

• Build supply chains for wafers, gases, chemicals, and equipment for solar cell manufacturing. Define incoming acceptance criteria for materials (e.g. silicon wafers, conductive pastes).   

• Address material and process challenges in panel-level packaging while spearheading the development of next-generation dielectric materials to improve packaging performance and scalability.   

• Specify and implement in-process metrology tools for quality control. Design wafer-level test structures to evaluate material/electronic properties. Integrate simulation tools with experimental data to guide and drive targeted improvements via material or process changes.   

• Drive end-to-end material and process R&D programs, from concept through product implementation, to drive cost down, efficiency improvements, and reliability in electronic systems.   

• Collaborate closely with le