Package Layout Engineer
densityaiMountain View, United StatesPosted 30+ days ago
- Salary
- USD 165,000 / year
- Level
- mid
About the role
About the role Own the physical layout of the advanced packages our AI accelerator silicon ships in. You'll take multi-die 2.5D and 3D packages from bump map through tapeout release — defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high-density escape and HBM-c…
Full details and requirements are on the company's own posting.
Listing sourced from the employer's own careers page via greenhouse. Removed automatically once the employer closes it. Employer: if you'd like this listing removed, email hello@pbridgeco.com.